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Laser bonder

With the world premiere of the laser bonder in 2015, F & K DELVOTEC GmbH once again proved the validity of its motto: Staying ahead in Bonding Technology.

The completely new process based on laser microwelding is particularly suitable for joining thick bonding wire on battery terminals and on DCB substrates and copper terminals in power electronics module housings. Using laser bonders, the application range of ribbon bonding is opened up for even higher currents.

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F & K DELVOTEC Bondtechnik GmbH | Daimlerstraße 5 | D-85521 Ottobrunn | Germany

E-Mail: shop@de.fkdelvotec.com

Phone: +49 89 62995 0

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